hometeam_pagedocument_archive
                                                                           
System Design
  • Thermal Subsystem
  •  Structural Subsystem
  •  Vacuum Subsystem
  •  Electrical Subsystem
  •  Software & Data Acquisition Subsystem
[For more details of subsystems and components see "Detailed Design Presentation"]
The Thermal Subsystem is made up from the following components:
  • Heat Flux Sensors
  • Thermocouples
  • Thin Heater
  • Peltier Cooler
  • Water Block (and pump/reservoir)
  • Insulation Between Heater and Frame
  • Radiative Shielding

High Temp Heat Flux Sensor
The Structural Subsystem is made up from the following components:
  • Internal Frame (Load Alignment andMisc. Brackets and Hardware)
  • Linear Actuator (and Springs)
  • Load Cell
  • Load Isolation

[Enhance]
The Vacuum Subsystem is made up from the following components:
  • Vacuum Chamber
  • Vacuum Seals
  • Vacuum Pump
  • Vacuum Feed-throughs

[Enhance]
The Electrical Subsystem is made up from the following items:
  • Sensors
  • Power Supply
  • Relays
  • Measurements
  • Powered Devices

The Software/DAQ Subsystem is made up from the following components:

  • NI PXI 1031 4 Slot 3U PXI Chassis
    • NI PXI 6251 PXI input card
      • NI SCC 68 Voltage box
  • NI PXI 6281 PXI input card
    • NI SCXI 1000  4 Slot SCXI Chassis
      • NI SCXI 1125 8 channel isolation amplifier
      • NI SCXI 1303  32 channel isothermal terminal block
[Devices Subject to Change]

...Also See...

(Previous Design Iteration)